Input sensing circuit including a pressure sensing part and a display including the same

ABSTRACT

An input sensing circuit includes a base film. A plurality of first sensors are disposed on the base film. A plurality of second sensors are disposed on the base film. An input sensing driver is configured to sense a capacitance value between a first sensor of the plurality of first sensors and a second sensor of the plurality of second sensors. A pressure sensing part is in contact with the first sensor and the second sensor and includes a synthetic resin and a conductive material.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2019-0017654 filed on Feb. 15, 2019, in the KoreanIntellectual Property Office, the disclosure of which is incorporated byreference herein in its entirety.

TECHNICAL FIELD

The present invention relates to an input sensing circuit and a displaydevice including the same, and more particularly, to an input sensingcircuit including a pressure sensing part and a display device includingthe same.

DISCUSSION OF RELATED ART

Display devices are used in various multi-media devices such as atelevision, a mobile phone, a tablet computer, a navigation system, or agame console. The display devices used in multi-media devices include akeyboard and or a mouse as an input device.

Display devices may also include an input sensing circuit capable ofsensing a touch of a user or a pressure applied by the user. In otherwords, the display device may include a touch screen display.

A display device may recognize a user's finger touching its screenthrough the input sensing circuit. The input sensing circuit senses atouch by using various techniques, for example: a resistive technique,an optical technique, a capacitive technique, or an ultrasonictechnique. When the capacitive technique is employed, a touch isdetected by using a capacitance that varies when a screen of the displaydevice is touched by a portion of a user's body, a tool (e.g., a touchpen), etc.

SUMMARY

Exemplary embodiments of the present invention provide for an inputsensing circuit including a pressure sensing part capable of sensing apressure applied by a user, and a display device including the same.

According to an exemplary embodiment of the present invention, an inputsensing circuit includes a base film. A plurality of first sensors aredisposed on the base film. A plurality of second sensors are disposed onthe base film. An input sensing driver is configured to sense acapacitance value between a first sensor of the plurality of firstsensors and a second sensor of the plurality of second sensors. Apressure sensing part is in contact with the first sensor and the secondsensor and includes a synthetic resin and a conductive material.

According to an exemplary embodiment of the present invention, the firstsensor and the second sensor are adjacent to each other. When a pressureapplied from the outside is equal to or greater than a predeterminedvalue, the pressure sensing part electrically connects the first sensorand the second sensor disposed adjacent to each other. When the pressureapplied from the outside is smaller than the predetermined value, thepressure sensing part electrically isolates the first sensor and thesecond sensor disposed adjacent to each other.

According to an exemplary embodiment of the present invention, thepressure sensing part is provided in plural, and the plurality ofpressure sensing parts overlap sensors which are disposed on an outerside of the plurality of first sensors and the plurality of secondsensors.

According to an exemplary embodiment of the present invention, theplurality of pressure sensing parts are disposed on the plurality offirst sensors and the plurality of second sensors.

According to an exemplary embodiment of the present invention, aplurality of first connection parts are provided, each of whichelectrically connects two first sensors adjacent to each other fromamong the plurality of first sensors. A plurality of second connectionparts are also provided, each of which electrically connects two secondsensors adjacent to each other from among the plurality of secondsensors. The pressure sensing part overlaps the first connection part ofthe plurality of first connection parts and the second connection partof the plurality of second connection parts.

According to an exemplary embodiment of the present invention, thepressure sensing part is interposed between the first connection partand the second connection part.

According to an exemplary embodiment of the present invention, each ofthe plurality of first sensors, the plurality of second sensors, theplurality of first connection parts, and the plurality of secondconnection parts, includes indium tin oxide (ITO) or indium zinc oxide(IZO).

According to an exemplary embodiment of the present invention, aplurality of openings are disposed in each of the plurality of firstsensors, the plurality of second sensors, the plurality of firstconnection parts, and the plurality of second connection parts.

According to an exemplary embodiment of the present invention, theplurality of first sensors are arranged in a first direction and extendin a second direction perpendicular to the first direction, and theplurality of second sensors are arranged in the second direction.

According to an exemplary embodiment of the present invention, a firstsignal line electrically connects the first sensor and the input sensingdriver. A second signal line electrically connects the second sensor andthe input sensing driver. The input sensing driver determines whether apressure has been applied by detecting a signal received through thefirst signal line and the second signal line.

According to an exemplary embodiment of the present invention, a firstsignal line electrically connects the first sensor of the plurality offirst sensors and the input sensing driver. A second signal lineelectrically connects the second sensor of the plurality of secondsensors and the input sensing driver. A first pressure sensing lineelectrically connects the pressure sensing part and the input sensingdriver. A second pressure sensing line is spaced apart from the firstpressure sensing line and electrically connects the pressure sensingpart and the input sensing driver.

According to an exemplary embodiment of the present invention, a displaydevice is provided including a main display surface parallel to asurface defined by a first direction and a second directionperpendicular to the first direction. A first sub-display surfaceextends along a first side of the main display surface. A secondsub-display surface extends along a second side of the main displaysurface. A third sub-display surface extends along a third side of themain display surface. A fourth sub-display surface extends along afourth side of the main display. A display panel including a pluralityof light-emitting diodes. An input sensing circuit is disposed on thedisplay panel. The input sensing circuit includes a plurality of sensorsincluding a plurality of first sensors and a plurality of secondsensors. A pressure sensing part is in contact with a first sensor ofthe plurality of first sensors and a second sensor of the plurality ofsecond sensors. The pressure sensing part includes a synthetic resin anda conductive material and overlaps at least one of the first sub-displaysurface, the second sub-display surface, the third sub-display surface,and the fourth sub-display surface. An input sensing driver isconfigured to sense a capacitance value between the first sensor and thesecond sensor.

According to an exemplary embodiment of the present invention, at leastone of the first sub-display surface, the second sub-display surface,the third sub-display surface and the fourth sub-display surface iscurved on a third direction perpendicular to the first direction and thesecond direction.

According to an exemplary embodiment of the present invention, when apressure applied from the outside is equal to or greater than apredetermined value, the pressure sensing part electrically connects thefirst sensor and the second sensor, and when the pressure applied fromthe outside is smaller than the predetermined value, the pressuresensing part electrically isolates the first sensor and the secondsensor.

According to an exemplary embodiment of the present invention, thepressure sensing part is provided in plural and the plurality ofpressure sensing parts are disposed on the plurality of first sensorsand the plurality of second sensors.

According to an exemplary embodiment of the present invention, the inputsensing circuit further includes a plurality of first connection parts,each of which electrically connects two first sensors adjacent to eachother from among the plurality of first sensors, and a plurality ofsecond connection parts, each of which electrically connects two secondsensors adjacent to each other from among the plurality of secondsensors. The pressure sensing part is provided in plural, and each ofthe plurality of pressure sensing parts overlaps any one firstconnection part of the plurality of first connection parts and any onesecond connection part of the plurality of second connection parts.

According to an exemplary embodiment of the present invention, thepressure sensing part is interposed between the first connection partand the second connection part.

According to an exemplary embodiment of the present invention, aplurality of openings are disposed in each of the plurality of firstsensors, the plurality of second sensors, the plurality of firstconnection parts, and the plurality of second connection parts. Theplurality of openings overlap the plurality of light-emitting diodes.

According to an exemplary embodiment of the present invention, the inputsensing circuit further includes a first signal line that electricallyconnects the first sensor and the input sensing driver and a secondsignal line that electrically connects the second sensor and the inputsensing driver. The input sensing driver determines whether a pressurehas been applied, by using a signal received through the first signalline and the second signal line.

According to an exemplary embodiment of the present invention, the inputsensing circuit further includes a first signal line that electricallyconnects the first sensor and the input sensing driver and a secondsignal line that electrically connects the second sensor and the inputsensing driver. A first pressure sensing line electrically connects thepressure sensing part and the input sensing driver and a second pressuresensing line is spaced apart from the first pressure sensing line andelectrically connects the pressure sensing part and the input sensingdriver. The input sensing driver determines whether a pressure has beenapplied, by detecting a signal received through the first pressuresensing line or the second pressure sensing line.

BRIEF DESCRIPTION OF THE FIGURES

The above and other features of the present invention will becomeapparent by describing in detail exemplary embodiments thereof withreference to the accompanying drawings, in which:

FIG. 1A is a perspective view illustrating a display device, accordingto an exemplary embodiment of the present invention;

FIGS. 1B and 1C are side views illustrating shapes of a display deviceof FIG. 1A;

FIG. 2 is a cross-sectional view illustrating a display device,according to an exemplary embodiment of the present invention;

FIGS. 3A and 3B are cross-sectional views illustrating a display moduleillustrated in FIG. 2;

FIG. 4 is a cross-sectional view illustrating a portion of a displaypanel according to an exemplary embodiment of the present invention;

FIG. 5 is a plan view illustrating an input sensing circuit according toan exemplary embodiment of the present invention;

FIG. 6A is an enlarged view illustrating portion AA of FIG. 5;

FIG. 6B is an enlarged view illustrating portion BB of FIG. 6A;

FIGS. 7A and 7B are cross-sectional views illustrating a cross sectiontaken along a line I-I′ of FIG. 6B, according to exemplary embodimentsof the present invention;

FIG. 8A is an enlarged view illustrating portion AA of FIG. 5, accordingto an exemplary embodiment of the present invention;

FIG. 8B is an enlarged view of portion BB-1 of FIG. 8A;

FIG. 9 is a cross-sectional view illustrating a cross section takenalong a line II-II′ of FIG. 8B;

FIG. 10 is a plan view of an input sensing circuit, according to anexemplary embodiment of the present invention;

FIG. 11 is a cross-sectional view illustrating a portion of a crosssection taken along a line III-III′ of FIG. 10;

FIG. 12 is a plan view of a display device according to an exemplaryembodiment of the present invention:

FIG. 13 is an enlarged view of area CC of FIG. 12;

FIGS. 14A, 14B, and 14C are enlarged views illustrating layers of thearea CC of FIG. 12;

FIGS. 15 and 16 are cross-sectional views illustrating a portion of across section of a display module, according to an exemplary embodimentof the present invention;

FIG. 17 is a plan view illustrating an input sensing circuit, accordingto an exemplary embodiment of the present invention; and

FIG. 18 is an enlarged view of portion EE of FIG. 17.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Exemplary embodiments of the present invention will now be describedmore fully hereinafter with reference to the accompanying drawings.

In drawings, proportions and dimensions of components may beexaggerated. FIG. 1A is a perspective view of a display device DDaccording to an exemplary embodiment of the present invention. FIGS. 1Band 1C are side views illustrating shapes of the display device DD ofFIG. 1A.

An example is illustrated in FIGS. 1A to 1C in which the display deviceDD is represented as a smartphone. However, the present invention is notlimited thereto. For example, the display device DD may be a small ormedium-sized electronic device, such as a mobile phone, a tablet, avehicle navigation system, a game console, or a smart watch, as well asa large-sized electronic device, such as a television or a monitor.

A display surface DA-M, DA-S1, DA-S2, DA-S3, DA-S4 may include a maindisplay surface DA-M, a first sub-display surface DA-S1, a secondsub-display surface DA-S2, a third sub-display surface DA-S3, and afourth sub-display surface DA-S4.

The display surface DA-M, DA-S1, DA-S2, DA-S3, DA-S4 refers to a surfacein which an image IM is displayed and a non-display surface NDA may beprovided in the display device DD. A clock and an icon are illustratedin FIG. 1A as an example of the image IM.

The non-display surface NDA may correspond to an area where the image IMis not displayed. A bezel area of the display device DD may correspondto the non-display surface NDA.

The non-display surface NDA may surround the display surface DA-M,DA-S1, DA-S2, DA S3, DA-S4. However, the present invention is notlimited thereto. For example, a shape of the display surface DA-M,DA-S1, DA-S2, DA-S3, DA-S4 may correspond to a shape of the non-displaysurface NDA.

The main display surface DA-M is parallel to a surface that is definedby a first direction (e.g., a DR1 direction) and a second direction(e.g., a DR2 direction). The normal direction of the main displaysurface DA-M, in other words, a thickness direction of the displaydevice DD corresponds to a third direction (e.g., a DR3 direction). Afront surface (also referred to as an upper surface) and a back surface(also referred to as a lower surface) of each member are spaced apart inthe third direction e.g., the DR3 direction). However, directions thatthe first, second, and third directions DR1, DR2, and DR3 indicate maybe relative and may be changed to different directions. Below, first tothird directions that are directions respectively indicated by thefirst, second, and third direction axes DR1, DR2, and DR3 are marked bythe same reference symbols.

The first sub-display surface DA-S1 may extend from a first side of themain display surface DA-M. The second sub-display surface DA-S2 mayextend front a second side of the main display surface DA-M. The thirdsub-display surface DA-S3 may extend from a third side of the maindisplay surface DA-M. The fourth sub-display surface DA-S4 may extendfrom a fourth side of the main display surface DA-M. For example, thefirst sub-display surface and the second sub-display surface DA-S1 andDA-S2 may refer to long sides of the display device DD, and the thirdsub-display surface and the fourth sub-display surface DA-S3 and DA-S4may refer to short sides of the display device DD.

Each of the sub-display surfaces DA-S1, DA-S2, DA-S3 and DA-S4 may becurved to have a given curvature in the third direction (e.g., the DR3direction).

The aesthetic sense of the display device DI) may be increased by thesub-display surfaces DA-S1, DA-S2, DA-S3, and DA-S4 having the givencurvature, and the area of the non-display surface NDA that isperceivable by the user may be decreased.

FIG. 2 is a cross-sectional view of the display device DD according toan exemplary embodiment of the present invention. FIG. 3A is across-sectional view of the display module DM of FIG. 2, and FIG. 3B isa cross-sectional view of a display module DM-1 according to anexemplary embodiment of the present invention. FIG. 2 shows a crosssection defined by the first direction (e.g., the DR1 direction) and thethird direction (e.g., the DR3 direction).

The display device DD may include the display module DM, a plurality offunction layers FC1, FC2 and FC3, a base film BF, a shock absorbingmember CSH, a radiation member RD, an electrostatic blocking member ESD,a bracket BRK, and a plurality of adhesive members AD1, AD2, AD3, AD4,AD5, AD6 and AD7.

In an exemplary embodiment of the present invention, each of theadhesive members AD1, AD2, AD3, AD4, AD5, A6 and AD7 may be a pressuresensitive adhesive (PSA).

The function layers FC1, FC2 and FC3 may be disposed over the displaymodule DM.

The first function layer FC1 may be adhered to the display module DM bythe first adhesive member AD1. The second function layer FC2 may beadhered to the first function layer FC1 by the second adhesive memberAD2. The third function layer FC3 may be adhered to the second functionlayer FC2 by the third adhesive member AD3.

In an exemplary embodiment of the present invention, each of thefunction layers FC1, FC2 and FC3 may include a polymer material and/orglass. Each of the function layers FC1, FC2 and FC3 may be provided inthe form of a film.

In an exemplary embodiment of the present invention, the first functionlayer FC1 may be a polarization function layer that polarizes incidentlight. The second function layer FC2 may be a shock absorbing functionlayer that absorbs a shock from the outside. The third function layerFC3 may be a window function layer that forms the exterior of thedisplay device DD. In another embodiment of the present invention, atleast one of the first to third function layers FC1, FC2 and FC3 may notbe included.

The base film BF, the shock absorbing member CSH, the radiation memberRD, and the electrostatic blocking member ESD are disposed under thedisplay module DM in the third direction (e.g., the DR3 direction).

The base film BF may be disposed under the display module DM. The basefilm BF may be adhered to the display module DM by the fourth adhesivemember AD4.

The base film BF may include a polymer material. In an exemplaryembodiment of the present invention, the base film BF may have a blackcolor.

The shock absorbing member CSH may be disposed under the base film BF.The shock absorbing member CSH may be adhered to a lower surface of thebase film BF by the fifth adhesive member AD5.

The shock absorbing member CSH may include a polymer material. The shockabsorbing member CSH may be a layer for absorbing a shock from theoutside.

In an exemplary embodiment of the present invention, the shock absorbingmember CSH may include thermoplastic polyurethane and/or foam rubber.

The radiation member RD may be disposed under the shock absorbing memberCSH. The radiation member RD may be adhered to a lower surface of theshock absorbing member CSH by the sixth adhesive member AD6.

The radiation member RD may be a component for radiating heat generatedin the display module DM to the outside. In an exemplary embodiment ofthe present invention, the radiation member RD may include a graphiteand/or stainless material.

The electrostatic blocking member ESD may be disposed under theradiation member RD. The electrostatic blocking member ESD may beadhered to a lower surface of the radiation member RD by the seventhadhesive member AD7.

The electrostatic blocking member ESD may prevent the display module DMfrom being affected by static electricity exposure introduced from theoutside. The electrostatic blocking member ESD may include metal. Forexample, the electrostatic blocking member ESD may include copper (Cu),iron (Fe), and/or aluminum (Al).

In an exemplary embodiment of the present invention, at least one of thebase film BF, the shock absorbing member CSH, the radiation member RD,the electrostatic blocking member ESD, and the fourth to seventhadhesive members AD4 to AD7 might not be included.

The bracket BRK may fix or accommodate the display module DM, the shockabsorbing member CSH, the radiation member RD, and the electrostaticblocking member ESD therein. According to an exemplary embodiment of thepresent invention, the bracket BRK may only partially overlap the thirdfunction layer FC3 in the first direction (e.g., the DR1 direction).

Referring to FIG. 3A, the display module DM may include a display panelDP and an input sensing circuit ISC. The input sensing circuit ISC maysense a touch and/or pressure that is applied from the outside.

The input sensing circuit ISC may be disposed directly on anencapsulation layer TFE (refer to FIG. 4) of the display panel DP. Here,the expression “disposed directly on” means that the input sensingcircuit ISC is disposed on the display panel DP without an interveningadhesive member.

Referring to FIG. 3B, the display module DM-1 may include the displaypanel DP, the input sensing circuit ISC, and an eighth adhesive memberAD8. The display panel DP and the input sensing circuit ISC may beadhered to each other by the eighth adhesive member AD8.

FIG. 4 is a cross-sectional view illustrating a portion of the displaypanel DP according to an exemplary embodiment of the present invention.

The display panel DP may include a base layer BL, a circuit layer CL, alight-emitting diode layer ELL, and the encapsulation layer TFE, forexample, sequentially stacked.

The circuit layer CL may include a buffer layer BFL gate insulatinglayers GI1 and GI2, an interlayer insulating layer ILD, a circuitinsulating layer VIA, for example, sequentially stacked. The circuitlayer CL may also include transistors T1 and T2. Each of the bufferlayer BFL, the gate insulating layers GI1 and GI2, the interlayerinsulating layer ILD, and the circuit insulating layer VIA may includean organic material and or an inorganic material.

The light-emitting diode layer ELL may include an organic light-emittingdiode OLED and a pixel definition layer PDL. The organic light-emittingdiode OLED may include an anode electrode AE, a hole control layer HL, alight-emitting layer EML, an electron control layer EL, and a cathodeelectrode CE.

A first opening OP1 that is provided the pixel definition layer PDL mayexpose an upper surface of the anode electrode AE of the organiclight-emitting diode OLED. The anode electrode AE may have a lowersurface disposed on the circuit insulating layer VIA and may include aperpendicular portion connected to the first transistor T1 through anopening formed in the circuit insulating layer VIA. For example, theopening in the circuit insulating layer VIA may expose an upper surfaceof the second contact plug ED2 of the first transistor T1 and theperpendicular portion of the anode electrode AE may contact an uppersurface of the second contact plug ED2 of the first transistor T1. Thesecond contact plug ED2 may be connected to the first contact plug ED1through an active layer ACL disposed on the buffer layer BFL. The firstand second contact plugs ED1 and ED2 may both penetrate through thecircuit layer CL in a thickness direction and contact an upper surfaceof the active layer ACL. A capacitor structure CP may be disposedbetween the first and second contact plugs ED1 and ED2. The capacitorstructure CP may include a first and second gate electrode GE1 and GE2spaced apart in a thickness direction. For example, the first gateelectrode GE1 may be disposed on an upper surface of the gate insulatinglayer GI1, and the gate insulating layer GI2 may have a lower surface atleast partially covering both the first gate electrode GE1 and the uppersurface of the gate insulating layer GI1. The second gate electrode GE2may have a lower surface disposed on an upper surface of the gateinsulating layer GI2. The encapsulation layer TFE may seal (orencapsulate) the light-emitting diode layer ELL to protect thelight-emitting diode layer ELL against external oxygen or moisture. Theencapsulation layer TFE may be a layer in which an organic layer and aninorganic layer are mixed.

An area, through which light generated by the organic light-emittingdiode OLED is emitted to the outside, of the display surface DA-M,DA-S1, DA-S2, DA-S3, DA-S4) may be defined as a pixel area PXA, and anarea that is not the pixel area PXA may be defined as a non-pixel areaNPXA.

The organic light-emitting diode OLED is exemplified in FIG. 4. However,the present invention is not limited thereto. For example, according toan exemplary embodiment of the present invention, the organiclight-emitting diode OLED may be replaced with a micro light emittingdiode (LED). In this case, a stacked structure of the display panel DPmay be changed to correspond to a micro LED structure.

FIG. 5 is a plan view of the input sensing circuit ISC according to anexemplary embodiment of the present invention. FIG. 6A is an enlargedview of portion AA of FIG. 5. FIG. 6B is an enlarged view of portion BBof FIG. 6A. FIGS. 7A and 7B are cross-sectional views illustrating aportion of a cross section taken along a line I-I′ of FIG. 6B.

An input sensing area SA that is capable of sensing an external inputand a non-input sensing area NSA at least partially surrounding theinput sensing area SA are provided in the input sensing circuit ISC.

The input sensing circuit ISC includes first sensor groups IEG1, secondsensor groups IEG2, first connection parts CP1, second connection partsCP2, first signal lines SSL1, second signal lines SSL2, signal padsPD-S1 and PD-S2, a printed circuit board FPCB-T, an input sensing driver300, and pressure sensing parts PSL. In an exemplary embodiment of theprose invention, as depicted in FIGS. 7A and 7B, the input sensingcircuit ISC further includes a sensor-base film BF-S, a first insulatinglayer IS1, and a second insulating layer IS2.

Each of the first sensor groups IEG1 extends in the first directione.g., the DR1 direction), and the first sensor groups IEG1 are arrangedin the second direction (e.g., the DR2 direction). Each of the firstsensor groups IEG1 includes first sensors IE1. The first sensors IE1 arearranged in the first direction (e.g., the DR1 direction), For example,the first sensor IE1 may be an Rx sensor.

Each of the second sensor groups IEG2 extend in the second direction(e.g., the DR2 direction), and the second sensor groups IEG2 arearranged in the first direction e.g., the DR1 direction). Each of thesecond sensor groups IEG2 include second sensors IE2. The second sensorsIE2 are arranged in the second direction (e.g., the DR2 direction). Forexample, the second sensor IE2 may be a Tx sensor.

In an exemplary embodiment of the present invention, a length of thefirst sensor groups IEG1 measured in the first direction (e.g., the DR1direction) may be shorter than a length of the second sensor groups IEG2measured in the second direction the DR2 direction).

In an exemplary embodiment the present invention, each of the firstsensors IE1 and the second sensors IE2 may include indium tin oxide(ITO) or indium zinc oxide (IZO). However, the present invention is notlimited thereto. For example, each of the first sensors IE1 and thesecond sensors IE2 may include molybdenum (Mo), titanium (Ti) and/oraluminum (Al).

In an exemplary embodiment of the present invention, each of the firstsensors IE1 may form a capacitance through capacitive coupling withsecond sensors IE2 adjacent to each of the first sensors IE1. The inputsensing circuit ISC may sense variations in capacitance between thefirst sensors IE1 and the second sensors IE2 and may determine whetheran input has been applied from the outside.

Referring to FIGS. 5 and 6A, dummy patterns DMP may be interposedbetween the first sensors IE1 and the second sensors IE2. The dummypatterns DMP may be spaced apart from the first sensors IE1 and thesecond sensors IE2. The dummy patterns DMP may be isolated from thefirst sensors IE1 and the second sensors IE2. A boundary area betweenthe first sensors IE1 and the second sensors IE2 may not be visible tothe user due to the arrangement of the dummy patterns DMP.

In an exemplary embodiment of the present invention, the dummy patternsDMP may include ITO and/or IZO. However, the present invention is notlimited thereto. For example, each of the dummy patterns DMP may includeMo, Ti and/or Al.

The first signal lines SSL1 may be electrically connected to the firstsensor groups IEG1, respectively. In an exemplary embodiment of thepresent invention, the first signal lines SSL1 may be electricallyconnected to the first sensor groups IEG1 in a single routing structure.

The second signal lines SSL2 may be electrically connected to the secondsensor groups IEG2, respectively. In an exemplary embodiment of thepresent invention, the second signal lines SSL2 may be electricallyconnected to the second sensor groups IEG2 in a double routingstructure.

In an exemplary embodiment of the present invention, each of the firstsignal lines SSL1 and the second signal lines SSL2 may includemolybdenum (Mo), titanium (Ti) and/or aluminum (Al). However, thepresent invention is not limited thereto. For example, each of the firstsignal lines SSL1 and the second signal lines SSL2 may include ITO orIZO.

The pressure sensing parts PSL may be disposed to overlap sensors IE1and IE2, which are disposed adjacent to the non-input sensing area NSA,from among the sensors IE1 and IE2. For example, the pressure sensingparts PSL may be disposed to overlap at least one of the sub-displaysurfaces DA-S1, DA-S2, DA-S3, and DA-S4 (refer to FIG. 1A).

Each of the pressure sensing parts PSL may include a conductive materialand a synthetic resin. For example, the conductive material may includemetal particles. In an exemplary embodiment of the present invention, asize of each of the metal particles may be a few nanometers (nm).

In an exemplary embodiment of the present invention, in the case where apressure is applied from the outside, each of the pressure sensing partsPSL may have conductivity by the tunneling effect that occurs betweenmetal particles.

In an exemplary embodiment of the present invention, in the case where apressure is applied from the outside, each of the pressure sensing partsPSL may have conductivity through a contact between metal particles.

In an exemplary embodiment of the present invention, each of thepressure sensing parts PSL may include a pressure conductive rubber.

In an exemplary embodiment of the present invention, each of thepressure sensing parts PSL may include quantum tunneling composite(QTC).

In an exemplary embodiment of the present invention, each of thepressure sensing parts PSL may have conductivity only when a pressureapplied from the outside is equal to or greater than a predeterminedpascal (Pa) value, and may not have conductivity when the pressureapplied from the outside is smaller than a predetermined Pa value.

The first signal pads PD-S1 are connected to the first signal linesSSL1. The second signal pads PD-S2 are connected to the second signallines SSL2.

The printed circuit board FPCB-T is electrically connected to the signalpads PD-S1 and PD-S2.

The input sensing driver 300 is mounted on the printed circuit boardFPCB-T. The input sensing driver 300 transmits/receives and/or processesan electrical signal for determining whether a touch of the user hasbeen made in the input sensing area SA and whether a pressure has beenapplied.

The input sensing driver 300 senses the variation in capacitance betweenthe sensors IE1 and IE2 by using the first signal lines SSL1 and thesecond signal lines SSL2.

In an exemplary embodiment of the present invention, the input sensingdriver 300 may sense whether at least one of the first sensors IE1 andat least one of the second sensors IE2 have been electrically connectedby the pressure sensing part PSL, by using the first signal lines SSL1and the second signal lines SSL2. In an exemplary embodiment of thepresent invention, in the case where the input sensing driver 300 sensesa current flowing between at least one of the first sensors IE1 and atleast one of the second sensors IE2, or in the case where a capacitancesensed between at least one of the first sensors IE1 and at least one ofthe second sensors IE2 is “0”, the input sensing driver 300 may sensethat a pressure has been applied from the outside.

However, the present invention is not limited thereto. For example, theinput sensing driver 300 may sense that a pressure is applied from theoutside, by using pressure sensing lines PPL separately connected torespective pressure sensing parts PSL. The pressure sensing lines PPLmay include a first pressure sensing line PPL1 and a second pressuresensing line PPL2 spaced apart from the first pressure sensing line PPL.

In an exemplary embodiment of the present invention, a driving timingfor determining whether a touch has been made may be different from adriving timing for determining whether a pressure is applied at theinput sensing driver 300. In the case where a signal for determiningwhether a touch has been made and a signal for determining whether apressure has been applied are performed simultaneously, one signal mayaffect the other signal and thus the input sensing driver 300 does notmake an accurate determination. However, the present invention is notlimited thereto. In an exemplary embodiment of the present invention, adriving timing for determining whether a touch is made may be the sameas a driving timing for determining whether a pressure is applied at theinput sensing driver 300.

The portion AA of FIG. 5 illustrated in FIG. 6A is defined as a unitarea AA in which the input sensing circuit ISC senses an external input.A left first sensor IE1-1, a right first sensor IE1-2, an upper secondsensor IE2-1, and a lower second sensor IE2-2 are disposed in the unitarea AA.

The first sensors IE1-1 and IE1-2 and the second sensors IE2-1 and IE2-2may form a capacitance within the unit area AA.

The left first sensor IE1-1 and the right first sensor IE1-2 may beelectrically connected by the first connection part CP1. The left firstsensor IE1-1 the right first sensor IE1-2, the first connection part CP1may be disposed in the same layer.

The upper second sensor IE2-1 and the lower second sensor IE2-2 may beelectrically connected by the second connection part CP2. At least aportion of the second connection part CP2 may be disposed in a differentlayer from the upper second sensor IE2-1 and the lower second sensorIE2-2.

An electrostatic preventing pattern may be connected to each of theupper second sensor IE2-1 and the lower second sensor IE2-2. Theelectrostatic preventing pattern may induce static electricity to avertex to prevent disconnection of the second connection part CP2.

Referring to FIGS. 7A and 7B, the second connection part CP2 may bedisposed on the sensor-base film BF-S.

The first insulating layer IS1 may be disposed on the sensor-base filmBF-S and may cover the second connection part CP2. For example, thefirst insulating layer IS1 may overlap the second connection part CP2 in(the second direction e.g., the DR2 direction). First contact holes CH1may be provided in the first insulating layer IS1. For example, thefirst contact holes CH1 may expose an upper surface of the secondconnection part CP2. Second contact holes CH2 may refer to a gap with awidth in the second direction (e.g., the DR2 direction) between ends ofthe upper second sensor IE2-1 and the lower second sensor IE2-2 andadjacent ends of the first connection part CP1. A first portion of eachof the second sensors IE2-1 and IE2-2 and the first connection part CP1may be disposed on the first insulating layer IS1. For example, thefirst portion of each of the second sensors IE2-1 and IE2-2 may have anend spaced apart from a respective end of the first connection part CP1in the second direction (e.g., the DR2 direction), and may overlap apressure sensing part PSL/PSL-1 in the thickness direction. The secondconnection part CP2 may be connected to the second sensors IE2-1 andIE2-2 through the first contact holes CH1. For example, a second portionof each of the second sensors IE2-1 and IE2-2 may orthogonally extendfrom the first portion in the thickness direction through respectivefirst contact holes CH1 onto the upper surface of the second connectionpart CP2 and electrically connect thereto.

The pressure sensing part PSL may cover at least a portion of the firstconnection part CP1 and at least a portion of the second sensors IE2-1and IE2-2. For example, referring to FIG. 7A, the pressure sensing partPSL may include a first portion extending in the second direction (e.g.,the DR2 direction) and a second portion orthogonally extending therefromin the thickness direction through second contact holes CH2 providedbetween ends of the second sensors IE2-1 and IE2-2 and adjacent ends ofthe first connection part CP1.

As described above, the pressure sensing part PSL may include aconductive material CDP and synthetic resin RS.

The second insulating layer IS2 may be disposed on the first insulatinglayer IS1 and may cover the second sensors IE2-1 and IE2-2, the firstconnection part CP1, and the pressure sensing part PSL.

Each of the first insulating layer IS1 and the second insulating layerIS2 may include an organic material and/or an inorganic material.

The sensor-base film BF-S illustrated in FIG. 7A may be replaced withthe encapsulation layer TFE (refer to FIG. 4) of the display panel DP.

Referring to FIG. 7B, a pressure sensing part PSL-1 may be interposedbetween the first connection part CP1 and the second connection partCP2. The pressure sensing part PSL-1 may extend in the second direction(e.g., the DR2 direction). For example, ends of the pressure sensingpart PSL-1 may be disposed at adjacent sidewalls of the first contacthole CH1. A layer in which the pressure sensing part PSL-1 illustratedin FIG. 7B is disposed may be different from a layer in which thepressure sensing part PSL illustrated in FIG. 7A is disposed. The firstand second ends of the pressure sensing part PSL-1 may correspond to aspace provided between the first and second portions of the secondsensors IE2-1 and IE2-2.

FIG. 8A is a modified embodiment of the embodiment of FIG. 6A. FIG. 8Bis an enlarged view of portion BB-1 of FIG. 8A. FIG. 9 is across-sectional view illustrating a portion of a cross section takenalong a line II-II′ of FIG. 8B.

Unlike the embodiments illustrated in FIGS. 6A to 7B, in an exemplaryembodiment illustrated in FIGS. 8A to 9, a second connection part CP2-1may be disposed in a higher layer than the first connection part CP1,for example, in the thickness direction. For example, the secondconnection part CP2-1 may have first portions that extend in a seconddirection (e.g., the DR2 direction) and second portions orthogonallyextending from corresponding first portions in the thickness directiononto an upper surface of the second sensors IE2-1 and IE2-2.

In detail, referring to FIG. 9, the first connection part CP1 and thesecond sensors IE2-1 and IE2-2 may be disposed on the sensor-base filmBF-S.

A pressure sensing part PSL-2 may be disposed on the sensor-base filmBF-S and may cover at least a portion of the first connection part CP1and at least a portion of the second sensors IE2-1 and IE2-2. Thepressure sensing part PSL-2 may be disposed between the secondconnection part CP2-1 and the first connection part CP1 in the thicknessdirection. For example, the pressure sensing part PSL-2 may include afirst portion extending in the second direction (e.g., the DR2direction) and overlapping the second sensors IE2-1 and IE2-2 and thefirst connection part CP1 in the thickness direction, and a secondportion extending orthogonally from the first portion in the thicknessdirection onto the sensor-base film BF-S.

The first insulating layer IS1 may be disposed in the same layer as thepressure sensing part PSL-2.

First contact holes CH1-1 may be provided between the first insulatinglayer IS1 and the pressure sensing part PSL-2.

The second connection part CP2-1 may be disposed on the first insulatinglayer IS1 and the pressure sensing part PSL-2. The second connectionpart CP2-1 may be connected to the second sensors IE2-1 and IE2-2through the first contact holes CH1-1. For example, the second portionsof the second connection part CP2-1 may be disposed in the first contactholes CH1-1.

The second insulating layer IS2 may be disposed on the first insulatinglayer IS1 and may cover the second connection part CP2-1. For example,the second insulating layer IS2 may overlap an upper surface andsidewalls of the first portion of the second connection part CP2-1 andan upper surface of the first insulating layer IS1.

FIG. 10 is a plan view of an input sensing circuit ISC-1 according to anexemplary embodiment of the present invention. FIG. 11 is across-sectional view illustrating a portion of a cross section takenalong a line III-III′ of FIG. 10.

The input sensing circuit ISC may include first sensors second sensorsIE12, first signal lines SSL11, second signal lines SSL12, first signalpads PD-S11, second signal pads PD-S12, the printed circuit boardFPCB-T, the input sensing driver 300, and pressure sensing parts PSL-3.In an exemplary embodiment of the present invention, the input sensingcircuit ISC may further include the sensor-base film BF-S, a firstinsulating layer IS1-1, and a second insulating layer IS2-1. The firstsignal lines SSL11 and the second signal lines SSL12 may also bereferred to as pressure sensing lines herein.

The first sensors IE11 may be arranged in the first direction (e.g., theDR1 direction). Each of the first sensors IE11 may extend in the seconddirection (e.g., the DR2 direction).

The second sensors IE12 may be disposed adjacent to a correspondingfirst sensor IE11 of the first sensors IE11. In this structure, aplurality of second sensors IE12 may be disposed adjacent to at leastone of the first sensors IE11.

The first signal lines SSL11 may be respectively connected to the firstsensors IE11, and the second signal lines SSL12 may be respectivelyconnected to the second sensors IE12.

The first signal pads PD-S11 may be respectively connected to the firstsignal lines SSL11, and the second signal pads PD-S12 may berespectively connected to the second signal lines SSL12.

The printed circuit board FPCB-T may be electrically connected to thesignal pads PD-S11 and PD-S12.

The input sensing driver 300 may be mounted on the printed circuit boardFPCB-T.

The input sensing driver 300 may sense the variation in a capacitancebetween the first sensors IE11 and the second sensors IE12.

The pressure sensing parts PSL-3 mays be disposed to overlap sensor IE11and IEI2, which are disposed adjacent to the non-input sensing area NSA,from among the sensors IE11 and IE12. The pressure sensing parts PSL-3may be disposed to overlap at least one of the sub-display surfacesDA-S1, DA-S2, DA-S3, and DA-S4 (refer to FIG. 1A).

Referring to FIGS. 10 and 11, the first sensors IE11, the second sensorsIE12, the first signal lines SSL11, and the second signal lines SSL12may be disposed on the sensor-base film BF-S.

The first insulating layer IS1-1 may be disposed on the sensor-base filmBF-S and may cover the first sensors IE11, the second sensors IE12, thefirst signal lines SSL11, and the second signal lines SSL12.

A second opening OP2 may be provided in the first insulating layerIS1-1. A pressure sensing part PSL-3 may be disposed in and correspondto the second opening OP2. The pressure sensing part PSL-3 may cover atleast a portion of the first sensor IE11 and at least a portion of thesecond sensor IE12 (e.g., upper surfaces in the thickness direction).

The second insulating layer IS2-1 may be disposed on the firstinsulating layer IS1-1 and may cover the pressure sensing part PSL-3,for example, in the thickness direction.

FIG. 12 is a plan view of an input sensing circuit ISC-2 according to anexemplary embodiment of the present invention.

The input sensing circuit ISC-2 may include first sensor groups IEG10,second sensor groups IEG20, first signal lines SSL21, second signallines SSL22 signal pads PD-S21 and PD-S22, the printed circuit boardFPCB-T, the input sensing driver 300, and a plurality of pressuresensing parts PSL-4.

Each of the first sensor groups IEG10 may include first sensors IE21.Each of the second sensor groups IEG20 may include second sensors IE22.

A plane of the input sensing circuit ISC-2 illustrated in FIG. 12 issubstantially the same as the plane of the input sensing circuit ISCillustrated in FIG. 5, and thus, additional description will be omittedto avoid redundancy.

FIG. 13 is an enlarged view of area CC of FIG. 12, FIGS. 14A, 14B, and14C are enlarged views illustrating layers of the area CC of FIG. 12.

Referring to FIG. 14A, second connection parts CP22 may be disposed on asilicon-buffer layer ISC-BF. The second connections parts CP22 mayinclude two portions spaced apart in the first direction e.g., the DR1direction).

The second connection parts CP22 may electrically connect two adjacentsensors of the second sensors IE22 (refer to FIG. 12).

Referring to FIG. 14B, a plurality of contact holes CTH may be providedin the first insulating layer IS1. The contact holes CTH may expose apart of the second connection parts CP22. In detail, the contact holesCTH may expose opposite ends of the second connection parts CP22. Forexample, opposite ends of the second connection parts CP22 may refer toends separated in the second direction (e.g., the DR2 direction).

16 contact holes CTH are exemplified in FIG. 14, but the presentinvention is not limited thereto. For example, the number of the contactholes CTH may be variously changed.

Referring to FIG. 14C, the first sensors IE21-1 and IE21-2, the secondsensors IE22-1 and IE22-2, and first connection parts CP21 may bedisposed on the first insulating layer IS1.

The left first sensor IE21-1 and the right first sensor IE21-2 may beelectrically connected by the first connection part CP21.

The upper second sensor IE22-1 and the lower second sensor IE22-2 may beelectrically connected, to the second connection part CP22 through thecontact boles CTH of the first insulating layer IS1.

Returning to FIG. 13, a direction between the first direction (e.g., theDR1 direction) and the second direction (e.g., the DR2 direction) may bedefined as a fourth direction (e.g., a DR4 direction). A fifth direction(e.g., a DR5 direction) may be defined as a direction perpendicular tothe fourth direction (e.g., the DR4 direction). For example, the fourthdirection (e.g., the DR4 direction) may form 45 degree angles with eachof the first direction (e.g., the DR1 direction) and the seconddirection (e.g., the DR2 direction). The fifth direction e.g., the DR5direction) may form a 45 degree angle with the first direction (e.g.,the DR1 direction) and may form a 135 degree angle with the seconddirection (e.g., the DR2 direction).

In the area CC, wires for the first sensors IE21-1 and IE21-2, thesecond sensors IE22-1 and IE22-2, the first connection part CP21, andthe second connection part CP22 may extend in the fourth direction e.g.,the DR4 direction) and/or the fifth direction (e.g., the DR5 direction).

In the area CC, a plurality of touch-openings OP-ISC may be providedbetween the wires for the first sensors IE21-1 and IE21-2, the secondsensors IE22-1 and IE22-2, the first connection part CP21, and thesecond connection part CP22. In an exemplary embodiment of the presentinvention, each of the touch-openings OP-ISC may correspond to the pixelarea PXA (refer to FIG. 4).

Each of the touch-openings OP-ISC may transmit a light that the organiclight-emitting diode OLED (refer to FIG. 4) generates. That is, thetouch-opening OP-ISC may overlap the anode electrode AE of the organiclight-emitting diode OLED (refer to FIG. 4). As such, a light that isgenerated by the organic light-emitting diode OLED (refer to FIG. 4) maybe emitted to the outside through the touch-opening OP-ISC.

FIGS. 15 and 16 are cross-sectional views illustrating a portion of across section of the display module DM (refer to FIG. 3A), according toan exemplary embodiment of the present invention.

Referring to FIGS. 4 and 15, in an exemplary embodiment of the presentinvention, a pressure sensing part PSL-4, may be interposed between thefirst connection part CP21 and the second connection part CP22. Forexample, the pressure sensing part PSL-4 may be disposed in the samelayer as the first insulating layer IS1.

Referring to FIGS. 4 and 16, in an exemplary embodiment of the presentinvention, a pressure sensing part PSL-5 may be disposed on at least apart of the first connection part CP21 and the second sensors IE22-1 andIE22-2 so as to cover the at least a part thereof.

FIG. 17 is a plan view of an input sensing circuit ISC-3 according to anexemplary embodiment of the present invention. FIG. 18 is an enlargedview of portion EE of FIG. 17.

Referring to FIGS. 17 and 18, corners RD of the input sensing area SA ofthe input sensing circuit ISC-3 may have a rounded shape.

The corners RD of the input sensing area SA may respectively correspondto a boundary portion of the first sub-display surface DA-S1 and thethird sub-display surface DA-S3 of the display device DD, a boundaryportion of the second sub-display surface DA-S2 and the thirdsub-display surface DA-S3 of the display device DD a boundary portion ofthe first sub-display surface DA-S1 and the fourth sub-display surfaceDA-S4 of the display device DD, and a boundary portion of the secondsub-display surface DA-S2 and the fourth sub-display surface DA-S4 ofthe display device DD.

According to an exemplary embodiment of the present invention, a displaydevice that includes an input sensing unit capable of sensing a touchfrom a user and an applied pressure may be provided.

While the present invention has been described with reference toexemplary embodiments thereof, it will be apparent to those of ordinaryskill in the art that various changes and modifications may be madethereto without departing from the spirit and scope of the presentinvention as set forth in the following claims.

What is claimed is:
 1. An input sensing circuit comprising: a base film;a plurality of first sensors disposed on the base film; a plurality ofsecond sensors disposed on the base film; an input sensing driverconfigured to sense a capacitance value between a first sensor of theplurality of first sensors and a second sensor of the plurality ofsecond sensors; a pressure sensing part in contact with the first sensorand the second sensor and including a synthetic resin and a conductivematerial; a plurality of first connection parts, each of whichelectrically connects two first sensors adjacent to each other fromamong the plurality of first sensors; and a plurality of secondconnection parts, each of which electrically connects two second sensorsadjacent to each other from among the plurality of second sensors, eachof the second connection parts being in direct contact with the basefilm, wherein the pressure sensing part overlaps a first connection partof the plurality of first connection parts and a second connection artof the plurality of second connection parts when viewed on a plane, andwherein the pressure sensing part is interposed between the firstconnection part and the second connection part when viewed in across-section.
 2. The input sensing circuit, of claim 1, wherein, thefirst sensor and the second sensor are adjacent to each other, andwherein when a pressure applied from the outside is equal to or greaterthan a predetermined value, the pressure sensing part electricallyconnects the first sensor and the second sensor disposed adjacent toeach other, and wherein, when the pressure applied from the outside issmaller than the predetermined value, the pressure sensing partelectrically isolates the first sensor and the second sensor.
 3. Theinput sensing circuit of claim 1, wherein the pressure sensing part isprovided in plural, and wherein the plurality of pressure sensing partsoverlap sensors which are disposed on an outer side of the plurality offirst sensors and the plurality of second sensors.
 4. The input sensingcircuit of claim 3, wherein the plurality of pressure sensing parts aredisposed on the plurality of first sensors and the plurality of secondsensors.
 5. The input sensing circuit of claim 1, wherein each of theplurality of first sensors, the plurality of second sensors, theplurality of first connection parts, and the plurality of secondconnection parts includes indium tin oxide (ITO) or indium zinc oxide(IZO).
 6. The input sensing circuit of claim 1, wherein a plurality ofopenings are disposed in each of the plurality of first sensors, theplurality of second sensors, the plurality of first connection parts,and the plurality of second connection parts.
 7. The input sensingcircuit of claim 1, wherein the plurality of first sensors are arrangedin a first direction and extend in a second direction perpendicular tothe first direction, and wherein the plurality of second sensors arearranged in the second direction.
 8. The input sensing circuit of claim1, further comprising: a first signal line that electrically connectsthe first sensor and the input sensing driver; and a second signal linethat electrically connects the second sensor and the input sensingdriver, wherein the input sensing driver determines whether a pressurehas been applied, by detecting a signal received through the firstsignal line and the second signal line.
 9. The input sensing circuit ofclaim 1, further comprising: a first signal line that electricallyconnects the first sensor of the plurality of first sensors and theinput sensing driver; a second signal line that electrically connectsthe second sensor of the plurality of second sensors and the inputsensing driver; a first pressure sensing line that electrically connectsthe pressure sensing part and the input sensing driver; and a secondpressure sensing line that is spaced apart from the first pressuresensing line and electrically connects the pressure sensing part and theinput sensing driver.
 10. A display device, comprising: a main displaysurface parallel to a surface defined by a first direction and a seconddirection perpendicular to the first direction; a first sub-displaysurface extending along a first side of the main display surface; asecond sub-display surface extending along a second side of the maindisplay surface; a third sub-display surface extending along a thirdside of the main display surface; and a fourth sub-display surfaceextending along a fourth side of the main display surface are defined; adisplay panel including a plurality of light-emitting diodes; and aninput sensing circuit disposed on the display panel, wherein, the inputsensing circuit includes: a plurality of sensors including a pluralityof first sensors and a plurality of second sensors; a pressure sensingpart in contact with a first sensor of the plurality of first sensorsand a second sensor of the plurality of second sensors, wherein thepressure sensing part includes a synthetic resin and a conductivematerial, and overlaps at least one of the first sub-display surface,the second sub-display surface, the third sub-display surface, and thefourth sub-display surface; and an input sensing driver configured tosense a capacitance value between the first sensor and the secondsensor, wherein the input sensing circuit further includes: a pluralityof first connection parts, each of which electrically connects two firstsensors adjacent to each other from among the plurality of firstsensors; and a plurality of second connection parts, each of whichelectrically connects two second sensors adjacent to each other fromamong the plurality of second sensors, each of the second connectionparts being in direct contact with a sensor base film, wherein thepressure sensing part is provided in plural, and each of the pluralityof pressure sensing parts overlaps any one first connection part of theplurality of first connection parts and any one second connection partof the plurality of second connection parts when viewed on a plane,wherein the pressure sensing part is interposed between the firstconnection tart and the second connection part when viewed in across-section.
 11. The display device of claim 10, wherein at least oneof the first sub-display surface, the second sub-display surface, thethird sub-display surface and the fourth sub-display surface is curvedon a third direction perpendicular to the first direction and the seconddirection.
 12. The display device of claim 10, wherein, when a pressureapplied from the outside is equal to or greater than a predeterminedvalue, the pressure sensing part electrically connects the first sensorand the second sensor, and wherein, when the pressure applied from theoutside is smaller than the predetermined value, the pressure sensingpart electrically isolates the first sensor and the second sensor. 13.The display device of claim 10, wherein the pressure sensing part isprovided in plural and the plurality of pressure sensing parts aredisposed on the plurality of first sensors and the plurality of secondsensors.
 14. The display device of claim 10, wherein a plurality ofopenings are disposed in each of the plurality of first sensors, theplurality of second sensors, the plurality of first connection parts,and the plurality of second connection parts, and wherein the pluralityof openings overlap the plurality of light-emitting diodes.
 15. Thedisplay device of claim 10, wherein the input sensing circuit furtherincludes: a first signal line that electrically connects the firstsensor and the input sensing driver; and a second signal line thatelectrically connects the second sensor and the input sensing driver,wherein the input sensing: driver determines whether a pressure has beenapplied, by using a signal received through the first signal line andthe second signal line.
 16. The display device of claim 10, wherein theinput sensing circuit further includes: a first signal line thatelectrically connects the first sensor and the input sensing driver; asecond signal line that electrically connects the second sensor and theinput sensing driver; a first pressure sensing line that electricallyconnects the pressure sensing part and the input sensing driver; and asecond pressure sensing line that is spaced apart from the firstpressure sensing line and electrically connects the pressure sensingpart and the input sensing driver, wherein the input sensing driverdetermines whether a pressure has been applied, by detecting a signalreceived through the first pressure sensing line or the second pressuresensing line.